Munich / Ismaning, Germany – October 20, 2020 – Limata, an innovative company specializing in the development of Laser Direct Imaging (LDI) systems for PCB manufacturing and related adjacent markets, has released its latest generation X3000 Laser Direct Imaging (LDI) system. The platform can handle dry film and solder mask laser direct imaging of the largest PCB panels without compromising the alignment accuracy and fine resolution resolution of its highest precision standards.
The current standard PCB panel size is typically 24″ x 18″, but today there is an increasing demand for larger panels (usually 24″ x 36″ or larger), as well as the production of flexible non-standard size PCBs. These large-scale exposure technology applications need to meet the growing number of end-use applications in the PCB industry, such as LED displays, 5G communications, aerospace, and EV-automotive electronics. In high frequency applications, the combination of using a large PCB instead of a small circuit board can provide better signal quality or lower signal attenuation while significantly reducing assembly and installation costs.
The X3000’s ability to handle large panel formats up to 110″ x 48″ also means the X3000 can simultaneously image multiple smaller pcbs in a single run, such as 12 standard boards of 24″ x 18″. This increases throughput by reducing loading and unloading times, which further equals lower cost per panel. In addition, because the X3000 can be loaded and unloaded from the front and back of the machine, the workflow can be flexibly set up on the production site. Limata CTO Matthias Nagel said: “With the X3000, we’ve left the industry with an impressive exposure system that can handle even the largest to extra-large boards, while still maintaining the quality of our small platform X1000 and mid-size X2000 devices. Equally excellent precision.”
“In addition, the X3000 supports reel-to-reel processing of unlimited lengths of flex boards, with the largest PCB produced to date measuring 25 meters in length.
Auto-calibration function: The LIMATA X3000 model has been proven quality in the current market and has been installed in many customer sites. The latest generation system builds further on the original X1000 series platform, already proven reliability and stability, and implements an integrated auto-calibration system that further provides extremely high accuracy – an unprecedented auto-calibration system that passes linear and non-linear Transforms to improve registration quality are automatically applied to any variant distortions detected. In addition to PCB production, this precision makes the machine ideal for applications such as chemical milling and industrial etching.
The LIMATA X3000 model can be configured with 2, 3 or 4 laser heads, providing 24 sets of UV lasers. The High Resolution (HR) option provides an adjustable laser spot size for advanced HDI production, reliable handling of solder mask bridges and resolution capabilities of 2 mil / 50um line width and line spacing. The platform utilizes a cost-effective high-energy UV diode laser that achieves a lifetime (MTBF) of over 25,000 hours, further reducing TCO.
Page 1 Fast Solder Mask Imaging: Like all of Limata’s x1000/X2000 series system platforms for solder mask LDI direct imaging tasks, the X3000 can also be equipped with Limata’s innovative LUVIR® technology, which uses both ultraviolet and infrared (IR) lasers Hybrid exposure to reduce UV power consumption. This significantly increases the exposure speed for direct imaging of Solder Mask Process (SM) and achieves a TCO that is over 40% lower than competing device systems.
Munich / Ismaning, Germany – October 20, 2020 – Limata, an innovative company specializing in the development of Laser Direct Imaging (LDI) systems for PCB manufacturing and related adjacent markets, has released its latest generation X3000 Laser Direct Imaging (LDI) system. The platform can handle dry film and solder mask laser direct imaging of the largest PCB panels without compromising the alignment accuracy and fine resolution resolution of its highest precision standards.
The current standard PCB panel size is typically 24″ x 18″, but today there is an increasing demand for larger panels (usually 24″ x 36″ or larger), as well as the production of flexible non-standard size PCBs. These large-scale exposure technology applications need to meet the growing number of end-use applications in the PCB industry, such as LED displays, 5G communications, aerospace, and EV-automotive electronics. In high frequency applications, the combination of using a large PCB instead of a small circuit board can provide better signal quality or lower signal attenuation while significantly reducing assembly and installation costs.
The X3000’s ability to handle large panel formats up to 110″ x 48″ also means the X3000 can simultaneously image multiple smaller pcbs in a single run, such as 12 standard boards of 24″ x 18″. This increases throughput by reducing loading and unloading times, which further equals lower cost per panel. In addition, because the X3000 can be loaded and unloaded from the front and back of the machine, the workflow can be flexibly set up on the production site. Limata CTO Matthias Nagel said: “With the X3000, we’ve left the industry with an impressive exposure system that can handle even the largest to extra-large boards, while still maintaining the quality of our small platform X1000 and mid-size X2000 devices. Equally excellent precision.”
“In addition, the X3000 supports reel-to-reel processing of unlimited lengths of flex boards, with the largest PCB produced to date measuring 25 meters in length.
Auto-calibration function: The LIMATA X3000 model has been proven quality in the current market and has been installed in many customer sites. The latest generation system builds further on the original X1000 series platform, already proven reliability and stability, and implements an integrated auto-calibration system that further provides extremely high accuracy – an unprecedented auto-calibration system that passes linear and non-linear Transforms to improve registration quality are automatically applied to any variant distortions detected. In addition to PCB production, this precision makes the machine ideal for applications such as chemical milling and industrial etching.
The LIMATA X3000 model can be configured with 2, 3 or 4 laser heads, providing 24 sets of UV lasers. The High Resolution (HR) option provides an adjustable laser spot size for advanced HDI production, reliable handling of solder mask bridges and resolution capabilities of 2 mil / 50um line width and line spacing. The platform utilizes a cost-effective high-energy UV diode laser that achieves a lifetime (MTBF) of over 25,000 hours, further reducing TCO.
Page 1 Fast Solder Mask Imaging: Like all of Limata’s x1000/X2000 series system platforms for solder mask LDI direct imaging tasks, the X3000 can also be equipped with Limata’s innovative LUVIR® technology, which uses both ultraviolet and infrared (IR) lasers Hybrid exposure to reduce UV power consumption. This significantly increases the exposure speed for direct imaging of Solder Mask Process (SM) and achieves a TCO that is over 40% lower than competing device systems.
The Links: LQ10D36E MG150Q2YS1 MIG200J6CMB1W
