Vice Chairman of Yangtze River Storage: Domestic 64-layer flash memory has been mass-produced, striving to build 300,000 wafers/month

Global flash memory will enter a bull market cycle in 2020, and prices are expected to rise sharply. This is also an opportunity for domestic flash memory. At the two meetings in Hubei a few days ago, Yang Daohong, the vice chairman of Yangtze Storage Technology Co., Ltd., said that the 64-layer flash memory they developed had been mass-produced last year and was expanding production capacity.

Yang Daohong said that at present and for a period of time in the future, the core mission of Yangtze River Storage is to promote the increase in production capacity. It will achieve a monthly production capacity of 100,000 pieces of 64-layer 3D flash memory products as soon as possible, and build 300,000 pieces/month production capacity on schedule to increase the national memory base. The scale effect promotes the development of the province’s integrated circuit industry.

In September 2019, YMTC announced the mass production of 64-layer stacked 3D flash memory with a capacity of 256Gb and TLC chips. Outsiders predict that the initial monthly production capacity will be around 5,000 wafers, and the goal for 2020 is to reach 60,000 wafers a month.

However, in order to have an impact on the global flash memory market, these production capacities are not enough. At present, the monthly production capacity of global flash memory chips is about 1.3 million wafers. Regardless of the expansion factors of Samsung, Toshiba and other companies, the production capacity of domestic flash memory will account for the world in 2020. The ratio is only 3%, which is still very small.

Yangtze Storage is currently constructing the first phase of the project, which started in March 2016, with a total investment of about 160 billion yuan. After completion, the total production capacity will reach 300,000 wafers/month, and the annual output value will exceed 10 billion U.S. dollars.

After the first phase of the project, there will be a second phase for memory chips and a third phase for foundry. When all of them are completed in 2030, the production capacity will reach 1 million wafers/month.

Author: Xianrui

Global flash memory will enter a bull market cycle in 2020, and prices are expected to rise sharply. This is also an opportunity for domestic flash memory. At the two meetings in Hubei a few days ago, Yang Daohong, the vice chairman of Yangtze Storage Technology Co., Ltd., said that the 64-layer flash memory they developed had been mass-produced last year and was expanding production capacity.

Yang Daohong said that at present and for a period of time in the future, the core mission of Yangtze River Storage is to promote the increase in production capacity. It will achieve a monthly production capacity of 100,000 pieces of 64-layer 3D flash memory products as soon as possible, and build 300,000 pieces/month production capacity on schedule to increase the national memory base. The scale effect promotes the development of the province’s integrated circuit industry.

In September 2019, YMTC announced the mass production of 64-layer stacked 3D flash memory with a capacity of 256Gb and TLC chips. Outsiders predict that the initial monthly production capacity will be around 5,000 wafers, and the goal for 2020 is to reach 60,000 wafers a month.

However, in order to have an impact on the global flash memory market, these production capacities are not enough. At present, the monthly production capacity of global flash memory chips is about 1.3 million wafers. Regardless of the expansion factors of Samsung, Toshiba and other companies, the production capacity of domestic flash memory will account for the world in 2020. The ratio is only 3%, which is still very small.

Yangtze Storage is currently constructing the first phase of the project, which started in March 2016, with a total investment of about 160 billion yuan. After completion, the total production capacity will reach 300,000 wafers/month, and the annual output value will exceed 10 billion U.S. dollars.

After the first phase of the project, there will be a second phase for memory chips and a third phase for foundry. When all of them are completed in 2030, the production capacity will reach 1 million wafers/month.

Author: Xianrui

The Links:   G104V1-T01 2DI150-050

Author: Yoyokuo