On November 8, Tongfu Microelectronics Co., Ltd. (hereinafter referred to as “Tongfu Microelectronics”) issued an announcement stating that the implementation of the company’s shareholder industrial fund reduction plan was completed. The company’s total shares are 2%, and the shareholding ratio has dropped from 17.13% to 15.13%.
Tongfu Microelectronics stated that the company’s shareholder National Integrated Circuit Industry Investment Fund Co., Ltd. (hereinafter referred to as the “Industry Fund”) plans to reduce its holdings through centralized bidding within 6 months after 15 trading days from the announcement date of the announcement of the reduction plan. The company’s stock does not exceed 2% of the company’s total share capital, that is, 26,580,738 shares, and has implemented the first reduction on June 10, 2021, and disclosed the “Simple Equity Change Report” on June 15, 2021 , on June 24, 2021, the “Announcement on the Progress of Shareholders’ Share Reduction Plan to Reduce More Than Half of the Shares” (Announcement No.: 2021-040) was disclosed, and on November 4, 2021, the “Shareholders’ Announcement on the Reduction of the Company’s Shares Reaching or Exceeding” 1% Announcement” (Announcement No.: 2021-064).
Now the company has received the “Notification Letter on the Completion of the Share Reduction Plan of Tongfu Microelectronics Co., Ltd.” issued by the Industrial Fund, and the implementation of the reduction plan has been completed. The industry fund reduced its holdings of 26,580,738 shares of the company through centralized bidding, and its shareholding ratio decreased from 17.13% to 15.13%. The specific reductions and changes in equity are as follows:
Shareholdings before and after the reduction:
According to the third quarter report of Tongfu Microelectronics in 2021, the company achieved revenue of 11.203 billion yuan in the first three quarters, a year-on-year increase of 51%; net profit attributable to the parent was 703 million yuan, a year-on-year increase of 168.56%. In this regard, Tongfu Microelectronics stated that in the third quarter of 2021, due to factors such as the accelerated development of global intelligence and the growth in demand for Electronic products, the company’s international and domestic customers’ order demand remained strong. Businesses in memory, consumer electronics, power devices, industrial and automotive electronics, and Display drivers continued to expand. The company’s orders were full, and the revenue scale and operating performance continued to grow.
On September 27 this year, Tongfu Microelectronics announced that it plans to raise no more than 5.5 billion yuan for the construction of memory chip packaging and testing production line construction projects, high-performance computing product packaging and testing industrialization projects, and 5G and other new-generation communication products packaging and testing. Construction of projects, wafer-level packaging product expansion projects, power device packaging and testing expansion projects, and repayment of bank loans and supplementary working capital. After all the above-mentioned fixed increase projects are completed and put into production, the company is expected to increase sales revenue by 3.759 billion yuan and after-tax profit by 445 million yuan every year.
On November 8, Tongfu Microelectronics Co., Ltd. (hereinafter referred to as “Tongfu Microelectronics”) issued an announcement stating that the implementation of the company’s shareholder industrial fund reduction plan was completed. The company’s total shares are 2%, and the shareholding ratio has dropped from 17.13% to 15.13%.
Tongfu Microelectronics stated that the company’s shareholder National Integrated Circuit Industry Investment Fund Co., Ltd. (hereinafter referred to as the “Industry Fund”) plans to reduce its holdings through centralized bidding within 6 months after 15 trading days from the announcement date of the announcement of the reduction plan. The company’s stock does not exceed 2% of the company’s total share capital, that is, 26,580,738 shares, and has implemented the first reduction on June 10, 2021, and disclosed the “Simple Equity Change Report” on June 15, 2021 , on June 24, 2021, the “Announcement on the Progress of Shareholders’ Share Reduction Plan to Reduce More Than Half of the Shares” (Announcement No.: 2021-040) was disclosed, and on November 4, 2021, the “Shareholders’ Announcement on the Reduction of the Company’s Shares Reaching or Exceeding” 1% Announcement” (Announcement No.: 2021-064).
Now the company has received the “Notification Letter on the Completion of the Share Reduction Plan of Tongfu Microelectronics Co., Ltd.” issued by the Industrial Fund, and the implementation of the reduction plan has been completed. The industry fund reduced its holdings of 26,580,738 shares of the company through centralized bidding, and its shareholding ratio decreased from 17.13% to 15.13%. The specific reductions and changes in equity are as follows:
Shareholdings before and after the reduction:
According to the third quarter report of Tongfu Microelectronics in 2021, the company achieved revenue of 11.203 billion yuan in the first three quarters, a year-on-year increase of 51%; net profit attributable to the parent was 703 million yuan, a year-on-year increase of 168.56%. In this regard, Tongfu Microelectronics stated that in the third quarter of 2021, due to factors such as the accelerated development of global intelligence and the growth in demand for Electronic products, the company’s international and domestic customers’ order demand remained strong. Businesses in memory, consumer electronics, power devices, industrial and automotive electronics, and Display drivers continued to expand. The company’s orders were full, and the revenue scale and operating performance continued to grow.
On September 27 this year, Tongfu Microelectronics announced that it plans to raise no more than 5.5 billion yuan for the construction of memory chip packaging and testing production line construction projects, high-performance computing product packaging and testing industrialization projects, and 5G and other new-generation communication products packaging and testing. Construction of projects, wafer-level packaging product expansion projects, power device packaging and testing expansion projects, and repayment of bank loans and supplementary working capital. After all the above-mentioned fixed increase projects are completed and put into production, the company is expected to increase sales revenue by 3.759 billion yuan and after-tax profit by 445 million yuan every year.
The Links: 1MBI400F-060 VI-22Y-CY
