Intel CEO Pat Gelsinger delivered an online speech in the early morning of the 24th Taipei time, explaining its IDM 2.0 strategy. IDM 2.0 is a major evolution of Intel’s vertically integrated manufacturing model (IDM), and announced a large-scale manufacturing expansion plan. First, it plans to invest about $20 billion to build 2 new fabs in Arizona, USA. At the same time, Intel plans to invest Painting became a major supplier of local foundry capacity in the U.S. and Europe to serve global customers.
According to Kissinger, Intel is the only company with the depth and breadth of software, wafers and platforms, packaging and processes with mass production capabilities that customers can rely on for the next generation of innovation. IDM 2.0 is a strategy of excellence that only Intel can provide, and a winning formula that we will use in every market segment to design the best products and manufacture them in the best possible way.
Intel CEO Pat Gelsinger reveals the specifics of the company’s IDM 2.0 strategy
Under the umbrella of IDM 2.0, Intel will focus on three major areas, enabling it to continue to drive technology and maintain product leadership:
First, continue to invest in advanced processes and production capacity. Intel’s own fabs around the world are a key competitive advantage for product optimization, economics and supply flexibility. Therefore, Intel will make relevant investments to achieve the goal of making most of its products in-house. At present, Intel’s 7nm process development is progressing quite smoothly, and it is more actively using extreme ultraviolet (EUV) technology. Intel is expected to provide Compute Tiles in the second quarter of this year for its development of its first 7-nanometer Client CPU, code-named Meteor Lake. In addition to process innovation, Intel’s leadership in packaging technology is also an important advantage, through the combination of multiple IP or “die blocks”, it provides unique customized products to meet the needs of diverse customers in the computing world .
Second, while increasing its own manufacturing strength, expand the use of third-party foundry capacity. Intel hopes to expand existing partnerships with third-party foundries, and many Intel products are currently produced by third-party foundries, such as communications, networking, graphics chips and chipsets. Gelsinger expects Intel’s collaboration with third-party foundries to continue to grow, including the use of advanced process technology to manufacture a series of modular chips (Modular Tiles), starting in 2023 to provide Intel’s PC and data center fields Computing-centric products. This move will provide greater flexibility and scale, and optimize the cost, performance, timing and availability of Intel’s product roadmap, giving Intel a unique competitive advantage.
Third, establish a world-class foundry business. Intel will aim to become a major supplier of wafer foundry capacity in the United States and Europe in the future to meet the huge global demand for semiconductor manufacturing. To achieve this vision, Intel is creating a new independent business unit, Intel Foundry Services (IFS), led by Intel executive Randhir Thakur, a semiconductor industry veteran, and directly Report to Kissinger. IFS will combine leading process technology and packaging, capacity availability in the US and Europe, and a world-class IP portfolio for customers, including x86 core, ARM and RISC-V ecosystem IP, to differentiate from other competitors .
In order to accelerate Intel’s IDM 2.0 strategy, Gelsinger announced that it will significantly expand Intel’s production capacity, starting with plans to build two new fabs in Intel’s Ocotillo campus in Arizona, which will support the growing needs of Intel’s products and customers, and Provide capacity commitments for foundry customers. However, Intel also plans to invest in areas outside Arizona, Kissinger said, if all goes well, in 2021 will announce investment plans in the United States, Europe and other global strongholds for the next phase of capacity expansion .
Intel plans to work with technology ecosystem and industry partners to realize the IDM 2.0 vision. To that end, Intel and IBM announced a major research collaboration to create next-generation logic and packaging technologies. For more than five decades, the two companies have shared a commitment to scientific research, advancing world-class engineering and bringing advanced semiconductor technologies to market. These foundational technologies will unlock the potential of data and advanced computing to create enormous economic value. Leveraging the technical capabilities and talent of both companies in Hillsboro, Ore., USA, and Albany, N.Y., the collaboration aims to accelerate innovation in semiconductor manufacturing across the ecosystem, increase the competitiveness of the U.S. semiconductor industry, and support critical U.S. government initiatives painting.
Finally, Intel will return to the spirit of the Intel Developer Forum (IDF, Intel Developer Forum) and launch a new industry conference – “Intel On”. Gelsinger encourages tech enthusiasts to come together at Intel’s innovation event scheduled for October in San Francisco.
Intel CEO Pat Gelsinger delivered an online speech in the early morning of the 24th Taipei time, explaining its IDM 2.0 strategy. IDM 2.0 is a major evolution of Intel’s vertically integrated manufacturing model (IDM), and announced a large-scale manufacturing expansion plan. First, it plans to invest about $20 billion to build 2 new fabs in Arizona, USA. At the same time, Intel plans to invest Painting became a major supplier of local foundry capacity in the U.S. and Europe to serve global customers.
According to Kissinger, Intel is the only company with the depth and breadth of software, wafers and platforms, packaging and processes with mass production capabilities that customers can rely on for the next generation of innovation. IDM 2.0 is a strategy of excellence that only Intel can provide, and a winning formula that we will use in every market segment to design the best products and manufacture them in the best possible way.
Intel CEO Pat Gelsinger reveals the specifics of the company’s IDM 2.0 strategy
Under the umbrella of IDM 2.0, Intel will focus on three major areas, enabling it to continue to drive technology and maintain product leadership:
First, continue to invest in advanced processes and production capacity. Intel’s own fabs around the world are a key competitive advantage for product optimization, economics and supply flexibility. Therefore, Intel will make relevant investments to achieve the goal of making most of its products in-house. At present, Intel’s 7nm process development is progressing quite smoothly, and it is more actively using extreme ultraviolet (EUV) technology. Intel is expected to provide Compute Tiles in the second quarter of this year for its development of its first 7-nanometer Client CPU, code-named Meteor Lake. In addition to process innovation, Intel’s leadership in packaging technology is also an important advantage, through the combination of multiple IP or “die blocks”, it provides unique customized products to meet the needs of diverse customers in the computing world .
Second, while increasing its own manufacturing strength, expand the use of third-party foundry capacity. Intel hopes to expand existing partnerships with third-party foundries, and many Intel products are currently produced by third-party foundries, such as communications, networking, graphics chips and chipsets. Gelsinger expects Intel’s collaboration with third-party foundries to continue to grow, including the use of advanced process technology to manufacture a series of modular chips (Modular Tiles), starting in 2023 to provide Intel’s PC and data center fields Computing-centric products. This move will provide greater flexibility and scale, and optimize the cost, performance, timing and availability of Intel’s product roadmap, giving Intel a unique competitive advantage.
Third, establish a world-class foundry business. Intel will aim to become a major supplier of wafer foundry capacity in the United States and Europe in the future to meet the huge global demand for semiconductor manufacturing. To achieve this vision, Intel is creating a new independent business unit, Intel Foundry Services (IFS), led by Intel executive Randhir Thakur, a semiconductor industry veteran, and directly Report to Kissinger. IFS will combine leading process technology and packaging, capacity availability in the US and Europe, and a world-class IP portfolio for customers, including x86 core, ARM and RISC-V ecosystem IP, to differentiate from other competitors .
In order to accelerate Intel’s IDM 2.0 strategy, Gelsinger announced that it will significantly expand Intel’s production capacity, starting with plans to build two new fabs in Intel’s Ocotillo campus in Arizona, which will support the growing needs of Intel’s products and customers, and Provide capacity commitments for foundry customers. However, Intel also plans to invest in areas outside Arizona, Kissinger said, if all goes well, in 2021 will announce investment plans in the United States, Europe and other global strongholds for the next phase of capacity expansion .
Intel plans to work with technology ecosystem and industry partners to realize the IDM 2.0 vision. To that end, Intel and IBM announced a major research collaboration to create next-generation logic and packaging technologies. For more than five decades, the two companies have shared a commitment to scientific research, advancing world-class engineering and bringing advanced semiconductor technologies to market. These foundational technologies will unlock the potential of data and advanced computing to create enormous economic value. Leveraging the technical capabilities and talent of both companies in Hillsboro, Ore., USA, and Albany, N.Y., the collaboration aims to accelerate innovation in semiconductor manufacturing across the ecosystem, increase the competitiveness of the U.S. semiconductor industry, and support critical U.S. government initiatives painting.
Finally, Intel will return to the spirit of the Intel Developer Forum (IDF, Intel Developer Forum) and launch a new industry conference – “Intel On”. Gelsinger encourages tech enthusiasts to come together at Intel’s innovation event scheduled for October in San Francisco.
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